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英特尔的第2代XPoint内存

April 30, 2021 Dr. Jeongdong Choe Intel's 2nd Generation XPoint Memory - Will it be worth the long wait ahead? In 2017, TechInsights analyzed the details on Intel 1st gen. XPoint Memory (OptaneTM Memory 16GB, MEMPEK1W016GA) including structure

30. Apr

高通公司扩大了其mmWave的领导地位

4月21日，2021年4月21日凯尔·诺兰高通公司延伸他们的MMWAVE领导地位5G MMWAVE仍远非全世界采用，但高通仍然在踏板上留在踏板上。没有人尾巴真的很近。高通公司的SR.董事之一

21. Apr

三星D1Z LPDDR5 DRAM与EUV光刻（EUVL） - 内存博客

April 16, 2021 Dr. Jeongdong Choe Originally published in Samsung D1z LPDDR5 DRAM with EUV Lithography (EUVL) Finally! After months of waiting, we have seen Samsung Electronics’ applied extreme ultraviolet (EUV) lithography technology for D1z DRAM in

16. Apr

全球首款1 Gb 28 nm STT-MRAM产品-Everspin

三月ch 30, 2021 Embedded & Emerging Memory World’s First 1 Gb 28 nm STT-MRAM Product - by Everspin Everspin’s new 1-Gigabit (Gb) Spin Torque Transfer Magneto-resistive Random Access Memory (STT-MRAM) device with a 28 nm process is the world’s first 1

31. 三月

TechInsights.identifies some of Blackberry’s highest value patent assets through portfolio analysis

2021年3月23日，Abdullah Rahal TechInsights通过投资组合分析来确定一些BlackBerry的最高价值专利资产TechInsights的分析师研究了BlackBerry Poldovio并将其分成十几个应用领域

23. 三月

KIOXIA’s new XL-FLASH for ultra-low latency NAND application

三月ch 23, 2021 Dr. Jeongdong Choe KIOXIA’s new XL-FLASH for ultra-low latency NAND application We’ve just found a new XL-FLASH product with 96L BiCS4 NAND cell architecture from KIOXIA. According to KIOXIA, XL-FLASH is extremely low-latency, high

23. 三月

Dynamic Vision Sensors – A Brief Overview - Image Sensor TechStream Blog

三月ch 16, 2021 Ziad Shukri Dynamic Vision Sensors – A Brief Overview Dynamic Vison Sensors are Asynchronous imagers. Much like the human eye, they are designed to respond to changes in brightness, with no “Frames” to capture. With DVS, individual

18. 三月

高级1 GB 28 NM STT-MRAM产品，来自Everspin Technologies

三月ch 16, 2021 Dr. Jeongdong Choe Advanced 1 Gb 28 nm STT-MRAM products from Everspin Technologies We’ve been waiting for a long time to see the technology details of Everspin’s new stand-alone 1-Gigabit (Gb) Spin Torque Transfer Magneto-resistive

16. 三月

A New and advanced ReRAM from Fujitsu

2021年3月9日，富士通博士博士博士从富士通进行了新的和先进的雷兰克兰，我们一直在富士通半导体分析新的RERAM产品。富士通8 MB MB85AS8MT是世界上最大的密度，作为独立的批量生产的Reram产品。这

11. 三月

GaN USB-C充电器市场在2021年加热

2021年3月10日Sinjin Dixon-Warren电力技术GaN USB-C充电器市场在2021镓氮化镓（GaN）的高功率USB充电器用于智能手机，平板电脑和笔记本电脑是电力电子市场的不断增长的区域。TechInsights.

10. 三月

商用高压碳化硅器件展望综述

2021年3月3日Peter Gammon博士对商用高压碳化硅器件的电源技术前景进行了展望——总结了碳化硅电源器件有可能达到30kV以上的额定电压，然而今天，碳化硅芯片制造商将重点放在

03 三月

网络研讨会：选定的成像器和传感器趋势和比较

3月3日，2021年图像传感器技术网络研讨会：选定的成像器和传感器趋势和比较现在按需！本网络研讨会的目的是从我们的2020个图像传感器设备Essentials（DEF）订阅年度共享所选内容

03 三月

LIDAR 101.– Solid-State and Mechanical LiDARs

2月19日，2021年汽车技术LIDAR 101 - 固态和机械LIDARS 2020是LIDAR制造商的令人兴奋的一年。五个LIDAR公司（Velodyne Inc，Luminar Technologies Inc，Inviniz Technologies Ltd，Aeva Inc，以及欧姆斯特

19. Feb

网络研讨会：为电动车（EV）革命而准备

演讲人：Stephen Russell&TechInsights Power Subscription为电子汽车（EV）革命做好准备最先进的电力设备全球绿色能源的发展正在加速。十年前，电动汽车是一种

03 Feb

Xiaomi Mi 11中的高通Snapdragon 888为市场带来了一个新的5纳米进入

2月03日，2021年2月逻辑破坏性技术下载简短的Qualcomm Snapdragon 888在Xiaomi Mi 11带来了一个新的5纳米进入市场，释放了Snapdragon 888，高通公司在竞争中与其他5纳米产品发布

03 Feb

三星Galaxy S21–竞争对手5nm解决方案，新设计胜出，1z EUV的LPDDR5？

February 02, 2021 Teardown Disruptive Technology Samsung Galaxy S21 – rival 5 nm solutions, new design wins, and LPDDR5 with 1z EUV? Right from the release announcement, it seemed the Samsung Galaxy S21 flagship phone was going to be a little bit

02 Feb

A三星的108MP图像传感器的回顾 - 图像传感器Techstream博客

February 02, 2021 Ziad Shukri A Recap of Samsung’s 108MP Image Sensors In 2019, Samsung introduced the first 108MP image sensor for mobile applications – the S5KHMX with ISOCELL Plus® technology. We first confirmed its use in the rear (wide) cam of

02 Feb

TechInsights.Cracks Open the STMicroelectronics MasterGaN2 - Power TechStream Blog

2021年2月2日新进迪克森沃伦TechInsights打开了意法半导体大师2 TechInsights最近完成了对意法半导体大师1的全面分析。我们发现这个装置包含两个相同的GaN系统

02 Feb

英特尔显示早期Ponte Vecchio部分 - 逻辑TechStream博客

2021年2月1日，迪克·詹姆斯·因特尔（Dick James Intel）展示了早期的庞特·维奇奥（Ponte Vecchio）部分，偶尔我们会在媒体上看到一些我们认为值得评论的东西，并以“万一你错过了”（ICYMI）博客的形式发布。在本案中，这是英特尔公司的

01 Feb

支持半导体行业的知识产权战略

支持半导体行业的知识产权战略Growing complexity of the chip market has made it harder than ever for intellectual property owners to monitor developments, making reverse engineering a crucial process The breadth of reverse

27. Jan

Sony d-ToF Sensor found in Apple’s new LiDAR camera

January 19, 2021 Image Sensor Disruptive Technology Sony d-ToF Sensor found in Apple’s new LiDAR camera Apple’s LiDAR camera was first observed in 2020’s iPad Pro; as expected, we saw that same part used in the iPhone 12 Pro in October. Industry

19. Jan

HiSilicon’s move towards an antenna to modem solution - Mobile RF TechStream Blog

2021年1月12日John Sullivan Hisilicon向天线转向调制解调器解决方案Hisilicon为华为的移动手机提供了RF收发器和移动SoC，但RF前端传统上是从通常的前端采购

12. Jan

英特尔推出2nd-Gen 3D XPoint内存，在IEDM - Memory Techstream Blog讨论

2020年12月28日，2020年Dick James Intel推出了2nd-Gen 3D XPoint Memory，在12月16日IEDM讨论了一个“内存和存储时刻”，他们宣布了五个新的内存和存储产品;两个Optane™SSD，一个用于数据中心和一个人

28. 12月

东芝集成二极管进入SIC MOSFET - Power Techstream Blog

2020年12月21日斯蒂芬罗素东芝集成二极管到碳化硅MOSFET每个碳化硅（SiC）制造商似乎有自己的方法来制造场效应管。无论是平面、沟道、JFET等，整个系统都没有主导设计

21. 12月

对苹果M1的分析正在进行——还有，热成像？

迪克·詹姆斯,名誉研究员迪克·詹姆斯是一个almost 50-year veteran of the semiconductor industry, working in the process development, design, manufacturing, packaging and reverse engineering of semiconductor devices. Dick is a regular contributor to

21. 12月

网络研讨会：汽车供应链中半导体IP的值增加

当今汽车供应链中的半导体IP增加，汽车不仅仅是运输设备。汽车是具有娱乐系统的热点，最先进的通信能力，以及最前沿

17. 12月

两个新的苹果soc，两个市场事件：苹果A14和M1

可用逻辑订阅>流程和高级包装>流程>晶体管表征> SOC设计分析>数字平面图分析>分析 - 数字平面图>标准单元GDS库分析>晶体管

16. 12月

Teardown: Velodyne Lidar Puck VLP-16 sensor

拆卸：Velodyne激光雷达圆盘VLP-16传感器（电子360）

A deep dive into the major components used in the light detection and ranging technology. Posted in Electronics360.

14. 12月

Webinar: Emerging GaN Technology in USB-C Power Delivery Adapters

Emerging GaN Technology in USB-C Power Delivery Adapters This event was presented by Sinjin Dixon-Warren & TechInsights Power adapters with a USB connection are ubiquitous in modern life. The wonderful mobile devices we use require regular connection

09 12月

3D flash memory, 176 layers!

So far, NAND Flash has shown a white-hot stage. Not long ago, storage vendors were still "seeing the scenery on the high platform of flash memory" with 128 layers.

09 12月

Wireless Charging Speeds Up - Teardown TechStream Blog

高级技术分析师斯泰西·韦格纳斯泰西Wegner is the Senior Technology Analyst of TechInsights’ Teardown division, responsible for ensuring the highly technical data produced by our analysts is transformed into consumable competitive

08 12月

网络研讨会：内存技术2020及以外 - NAND，DRAM，新兴和嵌入式内存技术趋势

内存技术2020及以后NAND、DRAM、新兴和嵌入式内存技术趋势本网络研讨会由TechInsights主办。在本网络研讨会上，Jeongdong Choe博士将详细介绍最新的NAND、DRAM、新兴和嵌入式内存技术趋势

02 12月

Webinar: An Examination of the Technical and Financial Implications of the Apple iPhone 12

An Examination of the Technical and Financial Implications of the Apple iPhone 12 This webinar was presented by TechInsights Join TechInsights and Bloomberg Intelligence Analysts as they share their technical and financial insights on Apple’s most

10. 11月

在STMicroelectronics Mastergan1内部GaN高压半桥-Techstream电源半导体博客

Sinjin Dixon-Warren，高级进程分析师Sinjin Dixon-Warren是一个高级进程分析师，技术人员拥有超过20年的半导体分析经验，是电力电子分析的主题专家（中小企业）。他持有A.

03 11月

微载荷及其对器件性能的影响

Semulator3D如何用于研究高级DRAM过程中的微负载和制造变量，该过程呈现出挥动伪造的AA轮廓。

02 11月

网络研讨会：市售存储器设备中的ALD / ALE进程

商业上可用内存D ALD /啤酒过程evices 2018 saw memory product manufacturers Samsung, Hynix, Toshiba and Micron introducing 64- or 72- stacked layer 3D-NAND devices, and move into 1x generation DRAM devices. This presentation will

28. Oct

十月苹果：苹果iPhone 12 Pro拆卸-拆卸TechStream博客

高级技术分析师斯泰西·韦格纳斯泰西Wegner is the Senior Technology Analyst of TechInsights’ Teardown division, responsible for ensuring the highly technical data produced by our analysts is transformed into consumable competitive

26. Oct

iphone相机历史：iphone 12的替代和正常

这evolutionary history of the iPhone camera can also be seen as the history of the development of the phone CIS, even if the iPhone does not fully follow the CIS technology trends to advance. Just take this opportunity, but also through the last

21. Oct

Micron-Memory Techstream Blog的新GDDR6x

Jeongdong Choe, Senior Technical Fellow Dr. Jeongdong Choe is a Senior Technical Fellow at TechInsights with nearly 30 years’ experience in semiconductor process integration for DRAM, (V)NAND, SRAM and logic devices. He regularly provides blog

15. Oct

STMicroelectronics在Galaxy Note系列中取代索尼TOF- Image Sensor TechStream Blog

Ray Fontaine, Product Manager – Image Sensor Ray is one of the preeminent image sensor technology experts in the world, and he regularly publishes Image Sensor analysis content and commentary for TechInsights subscribers. October 11, 2020 Samsung

11. Oct

一个新的球员出现在GaN充电器市场——我nnoscience INN650D02 Found Inside the Rock RH-PD65W USB-C Charger

Contributed by: Sinjin Dixon-Warren, PhD The emergence of gallium nitride (GaN) technology in the USB-C chargers is a new trend in the semiconductor market. Over the past year, TechInsights has found GaN technology from Navitas and from Power

08 Oct

Quick View on Samsung 128L (136T) 3D V-NAND - Memory TechStream Blog

Jeongdong Choe, Senior Technical Fellow Dr. Jeongdong Choe is a Senior Technical Fellow at TechInsights with nearly 30 years’ experience in semiconductor process integration for DRAM, (V)NAND, SRAM and logic devices. He regularly provides blog

08 Oct

USEDIC借助他们的SIC JFET技术 - 电源半导体Techstream博客

Sinjin Dixon-Warren，高级进程分析师Sinjin Dixon-Warren是一个高级进程分析师，技术人员拥有超过20年的半导体分析经验，是电力电子分析的主题专家（中小企业）。他持有A.

08 Oct

雪崩40纳米pMTJ STT-MRAM-内存TechStream博客

Jeongdong Choe, Senior Technical Fellow Dr. Jeongdong Choe is a Senior Technical Fellow at TechInsights with nearly 30 years’ experience in semiconductor process integration for DRAM, (V)NAND, SRAM and logic devices. He regularly provides blog

25. Sep

混合绑定从图像传感器扩展到逻辑，记忆 - 图像传感器，逻辑和内存Techstream博客

迪克·詹姆斯,名誉研究员迪克·詹姆斯是一个almost 50-year veteran of the semiconductor industry, working in the process development, design, manufacturing, packaging and reverse engineering of semiconductor devices. Dick is a regular contributor to

25. Sep

Webinar: Space, Power, BEAMs – Shorten the trek to gain the edge in 5G chip design and manufacturing

网络研讨会：空间、电源、光束——缩短长途跋涉，在5G收发机设计和制造方面取得优势

Space, Power, BEAMs Shorten the trek to gain the edge in 5G transceiver design and manufacturing The Mobile RF landscape has become more competitive with the introduction of 5G, complemented by relevant innovation aimed at addressing varying

23. Sep

DRAM, 3D NAND Face New Challenges

Semiconductor Engineering - Various memories and business outlooks are all over the map, sometimes literally, with lots of confusion ahead.

21. Sep

SK hynix 128L 3D PUC NAND (4D NAND)

SK hynix has released the world’s first 128-layer (128L) 3D NAND, which they have termed 4D NAND. This is their second NAND generation built using Periphery Under Cell (PUC) architecture; the first was their 96L NAND. In PUC architecture, peripheral

14. Sep

Intel RealSense L515激光雷达相机内部

Introduction The world of LIDAR sensing is evolving. Rotating turret LiDARs are commonplace for applications such as autonomous driving (see our Automotive LIDAR teardown subscription), but they are being displaced by a new generation of solid-state

11. Sep

Webinar: ALD/ALE Process in Commercially Available Logic Devices

商业上可用逻辑设备中的ALD / ALE进程2018的推出了一种新一代逻辑产品，以其10nm代微处理器的英特尔为单行，其次是TSMC和三星朝向的FinFET晶体管。

26. 八月

Samsung S5K33D i-ToF with 7 µm Pixel Global Shutter in House

Samsung S5K33D i-ToF with 7 µm Pixel Global Shutter - Image Sensor TechStream Blog

Ray Fontaine, Product Manager – Image Sensor Ray is one of the preeminent image sensor technology experts in the world, and he regularly publishes Image Sensor analysis content and commentary for TechInsights subscribers. August 12, 2020 Our teams

12. 八月

60 years of the Semiconductor industry and its changing patent strategy

Contributed by: Arabinda Das Today the semiconductor industry is a behemoth whose annual sales revenue crosses US $400 Billion. Over its 60 years of existence, this mature industry has experimented with various models like integrated device

04 八月

A Review of the Chevy Bolt Powertrain

Posted: July 09, 2020 Contributed by: Sinjin Dixon-Warren, PhD Electric vehicles (EV) are potentially a disruptive technology in the automotive market. They offer the promise of increased energy efficiency and the potential for reduced emissions

09 Jul

Memory Process Webinar: 3D NAND Word Line Pad (WLP)

Wednesday June 24, 2020 / 2:00 p.m. ET Hosted By: Chi Lim Tan 3D NAND, or vertical NAND, with its higher density and lower cost per bit, has been a driving force in the popularity of solid state drives (SSD) thanks to the innovation and continued

24. Jun

Intel’s 10nm Node: Past, Present, and Future – Part 2

有些人说，在2017年的H2 - H1 2018 TimeFrame Intel的10nm节点是如此烘焙，该英特尔必须显着重新设计其10 NM工艺技术的后续产品。无论如何，一个SKU和有限的可用性为自己说话。

17. Jun

Apple计算机：过渡到ARM Chips即将推出

Quand on dit ce mois-ci, c’est à l’occasion de la Conférence des développeurs qui se tiendra dans la semaine du 22 juin, un événement très important appelé WWDC ou Worldwide Developers Conference qui se tient en Californie, à San José ou à San

11. Jun

重新审视精髓APA光学GaH Hemt专利

Posted: June 05, 2020 Contributed by: Sinjin Dixon-Warren, PhD The power electronics industry is in a period of transition. For many years silicon-based devices have dominated the industry, with conventional Si MOSFET transistors being used for lower

05 Jun

Panasonic在专利货币化方面的专业知识从未如此重要

Like many other businesses, the Japanese heavyweight is under significant financial pressure thanks to the covid-19 pandemic, but its long track record of leveraging its IP assets could prove a saving grace

05 Jun

On Demand Webinar: A Review of the Power Device Ecosystem & IP Landscape for GaN

Wednesday May 27, 2020 / 2:00 p.m. ET Hosted By: Sinjin Dixon-Warren The power electronics industry is in a period of transition. For many years silicon-based devices dominated the industry, with conventional Si MOSFET transistors being used for

27. 五月

这guide to effective NAND patent investigation

通过波形和协议测试对于调查内存技术专利来说，用于使用的证据，TechInsights'Martin Bijman和Neil Macleod将仔细研究顶级NAND专利名称的投资组合，以确定如何不同

21. 五月

Unlocking the Secrets of the YMTC 64-Layer 3D Xtacking® NAND Flash

介绍YMTC的第二代3D-NAND技术，它使用“XTacking”与内存阵列面对面绑定外围电路而不是旁边。如在半导体摘要中发表的。

08 五月

SiC Power Transistor Process Flow Analysis: The Rohm SCT3022ALGC11 Process Flow

Contributed Author: Sinjin Dixon-Warren The market for Silicon Carbide (SiC) power transistors is expected to grow considerably over the coming years. SiC power transistors have several advantages over traditional silicon-based devices, including

05 五月

Patent Portfolio Management: Effective Strategies and Best Practices in 2020

4月29日 - 12：00-1：30 PM（et） - Live Webinar，“专利组合管理：由知识组托管的”专利组合管理：2020年的有效策略和最佳实践“。主要主题包括：专利组合管理趋势和发展，是一个重要的

29. Apr

选择合适的专利软件以获得更好的结果

这re have never been so many IP tools and technology aides on the market, but how do you decide which ones are going to help your business? Martin Bijman of TechInsights explains.

29. Apr

Analysis of Qualcomm's Snapdragon SDR865 Transceiver; supporting 5G sub-6 Ghz and LTE services

这Snapdragon 865 platform is Qualcomm's most advanced 5G chipset to date with support for 5G, sub-6, mmWave and LTE. 4G/5G dynamic spectrum sharing, will enable "operators to accelerate 5G deployments by using their existing 4G spectrum holdings to

27. Apr

Looking at the Apple A12Z Bionic System on Chip

Is the Apple A12Z bionic SoC just the A12X renamed, with an enabled GPU core? When we first got the Apple iPad Pro 2020 A2068 in our labs, this was the first thing we wanted to know. What is the A12Z? When we saw the A12Z, there was visually no

15. Apr

TechInsights在三星Exynos 990中证实了三星真正的7LPP工艺

去年，三星宣布将EUV引入其在Exynos 9825中使用的7LPP过程。通过分析，我们在9825年的7LPP进程与Exynos 9820中的8LPP过程之间发现了几乎没有差异。现在，我们

18. 三月

Recent Analysis of Samsung’s Mobile RF Components

香农5800 55M5800A01随着行业对5G应用的扩展，三星在移动通信技术领域不断创新，包括射频收发器、mmWave相控阵解决方案以及5G嵌入式移动处理器

03 三月

如果苹果因冠状病毒而受到伤害，它的供应商和竞争对手也可能是

Apple Inc的惊喜警告认为，由于冠状病毒流行病，这可能会缺乏本季度的销售目标，因为它的芯片和其他供应商以及也依赖中国建立产品的竞争对手。

18. Feb

联发科最新移动射频组件及分析

MT6303P AN10516CW 2.95 x 1.74 - 180nm移动射频架构在复杂程度上不断增加，以支持多种标准，我们在几乎每几个新手机释放中都发现了新的移动RF组件。在这种写作时

15. Jan

In 2020, 3D flash memory will be fully upgraded to 100 multi-layer stacks

3D闪存可以堆叠多少层？就像摩天大楼不可能无限期地堆积起来一样，3D闪存的层数也是有限的。

08 Jan

使用OTP NVM确保智能连接的房屋

这market for piracy is huge and hackers have become increasingly sophisticated even when security is implemented in hardware. The race between the aggressors and protectors is a battle without end. Smart connected home devices are increasingly

06 Jan

PC技术趋势2020-DRAM和Flash

新年の幕开着に，パーソナルコンピュータのハードウェア技术の动词を占う「pcテクノロジートレンド」するする。

04 Jan

Apple Is About to Add a Third OLED Supplier

这笔交易在制作中已经多年了。中国的BOE技术集团一直在达到自2017年初以来为iPhone提供的OLED显示器供应苹果。

31. 12月

华为伴侣30 pro 5g拆除：卖6399元，完成机器，BOM成本仅为2799元

据机构分析，4G版是华为首款没有美国零部件的智能手机产品，而5G版仍使用一些美国制造的零部件，比例是。。。

30. 12月

Deep dismantling of Huawei Mate30 Pro 5G: more than 2,000 components from Japan

从BOM表上看，整机预估价格为395.71元，折合人民币不到2800元，其中主控芯片约占整机价格的51.9%。

26. 12月

What’s Next For High Bandwidth Memory

Different approaches for breaking down the memory wall.

17. 12月

首尔半导体专利拍卖分析显示了一个混合的资产袋

Seoul Semiconductor recently dipped its toes into the sales side of the patent market with an announcement that it will be auctioning off two patent packages – one at the end of this month and the other in January.

12. 12月

Toshiba-WD Alliance 3D NAND mass production will use Samsung TCAT process

集微网消息（文/Yuna），据Impress Watch网站报道，东芝在12月8日召开的IEDM会议上声明在3D NAND闪存量产中采用类似于三星TCAT的存储单元结构。

12. 12月

Developing a successful licensing program

As first published in the Patent Lawyer, Martin Bijman, Director of IP Products at TechInsights, explains how formalized assertion programs can benefit rights holders.

25. 11月

DRAM Scaling Challenges Grow

More nodes and alternative memories are in the works, but schedules remain murky.

21. 11月

桌面彗星湖将出现在2020年2月左右？英特尔CPU路线图

TechInsights于10月31日发布了名为“英特尔核心I7-1065G7”冰湖“10 NM 2ND Gen处理器分析”的摘要报告。

18. 11月

Kirin 990 5G core data exposure: 113.31 square millimeters integrated 10.3 billion transistors

Recently, Huawei released its new 5G mobile phone, the Mate 30 5G series. The performance of its Kirin 990 5G SoC is very exciting. Recently, professional chip research institute TechInsights dismantled this commercial 5G integrated SoC chip.

12. 11月

TIPS Webinar: Techniques to Analyze NAND Flash and SSD Devices

Date: November 6, 2019 / 3:00pm to 4:00pm ET Presented By: Neil MacLeod and Marty Bijman Internal Probing, Waveform Analysis, and More The widespread adoption and expansion of data centers has driven the SSD market to a period of high competition and

06 11月

Intel Core i7-1065G7 “Ice Lake” 10 nm+ Processor Analysis

Intel Core i7-1065G7 “Ice Lake” 10 nm 2nd Gen Processor Analysis

Intel has released their first 10 nm 2nd Gen processor into consumer products – the Intel Core i7-1065G7 processor, better known as Ice Lake. Dell and Microsoft have already announced the inclusion of Ice Lake in some of their latest offerings. This

31. Oct

这Apple iPhone 11, 11 Pro & 11 Pro Max Review: Performance, Battery, & Camera Elevated

TechInsights.has now officially released a die shot of the new Apple A13, and we can confirm a few assumptions on our side.

27. Oct

TechInsights：iPhone 11 Pro Max Cameras花费73.5美元

TechInsights.publishes its estimation of Apple iPhone 11 Pro Max components. The cameras appear to be the post expensive part at $73.50.

09 Oct

电子移动性如何改变汽车

With some TechInsights industry experts, Morahari Reddy and Jianchun Xu, we will analyze the market and focus on different aspects.

07 Oct

E-Government - Deep Analysis of Intel Ice Lake: Innovation across Six Pillars

在今年的台北电脑展上，英特尔推出了第10代核心处理器，即10NM工艺冰湖处理器。

07 Oct

SK Hynix 96L 3D PUC NAND分析

Among memory manufacturers worldwide SK hynix currently holds the 5th position in NAND Flash market share, with 10.3%. They are the latest to release a 9X-layer NAND solution, with the SK hynix 96L 3D PUC NAND. Development of SK hynix’ 96L 3D PUC

27. Sep

TechInsights.Analyses iPhone 11 Cameras

TechInsights.publishes a teardown report of the new Apple iPhone 11 Pro Max smartphone with some info on its cameras:

26. Sep

Apple iPhone 11 Pro Teardowns Look Encouraging for STMicro and Sony

STMicroelectronics and Sony each appear to be supplying four chips for Apple's latest flagship iPhones. Many other historical iPhone suppliers also make appearances in the latest teardowns.

26. Sep

专利授权：专利作战计划

Successful, high-return patent licensing programmes require planning. Peter Hanschke of TechInsights offers a guide to getting it right.

23. Sep

网络研讨会：准备许可证：使用工具来扩展许可计划

最初呈现：2019年9月19日至12:00至下午1:00 et托管：Martin Bijman许可是一种审判和真实的手段，可以将专利组合货币化，但那些将成功地从专利所有权到专利利润的路径不会

19. Sep

Micron Analysis Overview: LPDDR4 DDR4 3D NAND Flash and XPoint Reverse Engineered

发布时间：2019年9月17日，2018年收入为30.4B美元，在NAND闪存中的16.5％市场份额，23％的市场份额在DRAM中，Micron是存储和内存技术中最大的球员之一。对于那些寻求支持他们的产品的人

17. Sep

图形解决方案如何改善3D NAND有效设备密度

由Moore的定律驱动，记忆和逻辑芯片半导体制造商通过增加晶体管密度来降低产品成本并提高性能。

16. Sep

网络研讨会：功率半导体– A Market Overview & In-depth SiC and GaN Device Analysis

Previous Broadcast: Tuesday, September 10, 2019 and Tuesday, October 8, 2019 Hosted By: Jianchun Xu and Sinjin Dixon-Warren The power semiconductor market is estimated to reach $32B USD by the end of 2025. Fueled by increasing global demand for more

10. Sep

Lithium, the white gold of technology

这price of the mineral collapses, but the batteries continue to consume this white king.

10. Sep

Mobile manufacturing: How much do companies earn with the high end?

High-end smartphones have been increasing in price over the years to become unattainable devices for ordinary people.

08 Sep

Peloton IPO Preview: All Hype, No Muscle

Peloton, which manufactures and sells premium, large-screen, stationary fitness bikes and treadmills, as well streaming subscriptions for classes aimed at those using the equipment, is expected to go public sometime in the next few months.

03 Sep

Un móvil de gama alta se vende casi al triple de lo que cuesta fabricarlo

Un teléfono móvil se vende casi tres veces más caro de lo que cuesta fabricarlo, atendiendo al coste de todos los componentes que integran estos dispositivos, desde la batería o la cámara hasta el sistema operativo que permite que funcionen las

02 Sep

高端手机销售近三倍的成本制造它

在制造它的成本上，手机销售速度几乎是贵重的，考虑到所有组成这些设备的成本，从电池或相机到允许应用程序的操作系统

02 Sep

中国进口的关税在星期天开始。新闻8看着他们将花费你的东西

Sunday will be the first round of tariffs. Almost monthly through the end of the year, the government plans to impose additional tariffs on different items.

31. 八月

为什么我在传感器中始终写入“漏出”

DPReview's review of the Fujifilm GFX 100 medium format camera shows the consequences of having dead pixels whose space is used for phase detection autofocus (PDAF) modules

31. 八月

12月a Technologies Fan-In WLP in Qualcomm PM8150

发布时间：2019年8月29日，粉丝在WLP市场预计以稳定增长;2018年的2.9亿美元至44亿美元至2024美元，CAGR 6.5％。该市场的最近贡献者之一是Deca Technologies，其M系列扇出晶圆级包装

29. 八月

Velodyne LiDAR Puck Teardown

发布时间：2019年7月22日根据BIS研究，2017年汽车利达市场估计为3.53亿美元，预计将达到2028年的8.32亿美元。激光雷达市场已成为汽车最具竞争力的部分之一

22. Jul

AC适配器：GaN，SiC或Si？

Effective high-power, compact AC adapters can be built using SiC, GaN, and Si super junction devices, according to an analysis by TechInsights of three key products.

16. Jul

Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU

发布日期：2019年6月11日Ambiq Micro Apollo 3 Blue超低功耗MCU MCU市场拥挤且竞争激烈，全球半导体公司在这一技术领域的研发投入不断增加；预计该市场在2019年将达到约200亿美元

10. Jun

1y DDR4 DRAM from Samsung, SK hynix and Micron

发布日期：2019年6月7日三星LPDDR4X 17纳米1Y三星DDR4 17纳米1Y微米MT40A2G4SA-062E 8Gb DDR4前三大DRAM制造商（三星、SK hynix和微米）在2017年和2018年推出1x后达到了20纳米以下。一个新的里程碑诞生了

05 Jun

How long can Sony keep the top spot in the image sensor market?

不久前，Yuanta Research发布了全球CIS（CMOS图像传感器）的市场数据，指出其整体市场规模仍在迅速增长。

05 Jun

Qualcomm QTM052 mmWave Antenna Module

Posted: May 31, 2019 Qualcomm QTM052 mmWave Antenna Module Qualcomm claims to have “Made the impossible, possible” by incorporating mmWave technology into the mobile RF front end in a small, highly integrated module. There are many challenges

31. 五月

NAND技术：打开大门

In the $60bn NAND tech market, patent landscape analysis can give companies the edge, as Martin Bijman and Trevor Izsak of TechInsights explain.

13. 五月

网络研讨会：识别和追求专利侵权者 - 使用技术证据构建您的断言活动

在它的心中，断言活动依赖于使用的证据（EOU），以证明持续侵权的存在。如果没有人使用专利组合所涵盖的技术，那么您的专利并不那么有价值。相反，当有柜会时，专利组合的价值更大。

02 五月

Electric Cars Gain Traction, But Challenges Remain

（半导体工程）预计电池供电的电动汽车将在2019年出货量达到一个里程碑，但该技术面临着几个重要的障碍，以获得市场上更广泛的采用。

22. Apr

9x层3D NAND分析

发布日期：2019年4月10日TechInsights对三星、东芝和Intel/Micron TechInsights解决方案的分析已经开始，这些备受期待的9XL 3D NAND解决方案包括：三星92L 3D V-NAND和东芝96L 3D BiCS Intel/Micron 96L

10. Apr

网络研讨会：高密度扇形包技术 - 检查和比较

最初提出:2019年4月9日/ 2点3:00pm ET Hosted By: Michel Roy Low-density fan-out package technology has been around for more than a decade. Due to limitations in RDL counts and capabilities in line space / line width, this

09 Apr

3D NAND Metrology Challenges Growing

(Semiconductor Engineering) The big challenge is to characterize the inner portions of a 3D NAND device, which consists of complex materials, multiple layers and tiny channel holes. Then, as you add more layers, the metrology challenges increase “due

09 Apr

自治车辆正在推动创新

Advances in AVs are having a ripple effect in multiple technology fields, from radar and LiDAR to signal processing. However, the rapid innovation pace is also creating challenges for automakers.

29. 三月

Siemens patent filings climb, but quality over quantity is the name of the game

In 2018 Siemens leapfrogged Huawei to become the number one filer at the EPO, a spot that it has not occupied since 2011. It has invested ...

25. 三月

Webinar: The Mobile Radio Frequency Landscape

Originally Presented: February 27, 2019 / 3:00pm to 4:00pm ET Hosted By: John Sullivan A Patent and Technology Perspective We estimate the mobile Radio Frequency (RF) market to be worth approximately $19B. Mobile RF innovation aims to improve

27. Feb

Tesla poised to apply Maxwell’s dry electrode innovation to battery cell fabrication

特斯拉准备将麦克斯韦的干电极创新应用于电池制造

发布时间：2019年2月7日投稿作者：Marty Bijman和Jim Hines图1-特斯拉的投资组合，包括麦克斯韦和SolarCity收购图2-特斯拉投资组合景观，显示哪些发明源自特斯拉、SolarCity和

07 Feb

TIPS - Finding Evidence of Use in Technology: the Good, the Bad, and the Ugly

网络研讨会：寻找技术中使用的证据 - 善良，坏的和丑陋

Originally Presented: December 12, 2018 / 2:00pm to 3:00pm ET Hosted By: Martin Bijman TechInsights has identified Evidence of Use (EoU) for over 6,000 unique patents. In doing so, we have significantly evolved our understanding of what patents can

12. 12月

网络研讨会：利用技术证据加强专利

Originally Presented: October 23, 2018 / 12:00pm to 1:00pm ET Hosted By: Mary Lupul Patent Strengthening is a term we use to describe the different methods that can be applied during the prosecution to both maximize the usefulness of a patent once it

23. Oct

Optimizing Patent Prosecution to Achieve Stronger, More Valuable Patents

网络研讨会：优化专利起诉以实现更强，更有价值的专利

Originally Presented: October 4, 2018 / 12:00 pm - 1:00 pm EDT Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –

04 Oct

网络研讨会：将领先的STB，流设备和智能电视进行比较 - 设计和BOM视角

Originally Presented: September 18, 2018 / 2:00pm to 3:00pm ET Hosted By: Stacy Wegner With a significant cord-cutting trend, much has been said about how operators are reacting and modifying their offerings to retain subscribers tempted by streaming

18. Sep

Automotive Patents: Owners, Technologies, and Investigating for EOU

Originally Presented: July 11, 2018 / 2:00pm to 3:00pm ET Hosted By: Jim Hines The automotive industry is facing disruption from new market entrants, emerging mobility business models and changing consumer attitudes about car ownership. The future of

11. Jul

https://www.ipwatchdog.com/2018/06/20/creating-better-applications-through-patent-strengthening/id=98439/

通过专利强化创造更好的应用雷竞技会黑钱吗

Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.

20. Jun

Intel 10 nm Logic Process Analysis (Cannon Lake)

Posted: June 12, 2018 Intel 10nm Logic Process Analysis TechInsights has found the long-awaited Cannon Lake - the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad330. This innovation boasts the following: Logic transistor

12. Jun

SK Hynix 72L 3D NAND分析

Posted: May 31, 2018 SK hynix 72L 3D NAND Analysis SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation has a block size 50% larger compared to 48-layer 3D TLC chips, it has a lower programming time

31. 五月

网络研讨会：黑匣子揭示 - 在挑战产品领域调查专利技术

最初呈现：2018年5月3日至3:15 PM至4:00 PM ET主持：Martin Bijman“黑匣子揭示”是我们用来指的“硬质品” - 技术，这是一个原因或另一个难以分析使用证据。这些可以

03 五月

What does Uber’s patent landscape look like?

发布时间：2018年2月27日贡献作者：Marty Bijman最近，Iam的Timothy Au发布了一篇博客，提供了外观优步的投资组合。博客参考了优步的投资组合化妆，并在过去5年中提供了他们的IP事件的编年史

27. Feb

Webinar: Patent Portfolio Monetization Key Considerations for Companies in 2018 and Beyond

最初呈现：2018年2月20日至3:00至下午5:00托管：Martin Bijman＆George Pappas专利加强是指在控方期间从专利中实现最大价值潜力的术语 -雷竞技会黑钱吗

20. Feb

Webinar: Unlocking the Value in Software Patents - a Technical Perspective

最初呈现：2018年2月1日/ 12:00 PM - 1:00 ethet ethered by：Mike Mclean，Gene Quinn＆Walter Hanchuk Alice对软件专利产生了影响，但它们可以且仍然确实保持重大价值。如果您的投资组合包含软件

01 Feb

COVID-19

We have been closely monitoring the progress of COVID-19 in recent weeks, regularly updating our travel and operations policies to include increasingly strict restrictions we have chosen to implement. Our priority is ensuring the continued health and

04 三月

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利益冲突和客户机密信息管理

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