Product Code
MFR-1907-802
Availability
Published
Product Item Code
MIC-MT44K32M36RCT-125
Device Manufacturer
Micron Technology
Device Type
DRAM
Subscription
备忘录ry - NAND & DRAM
Channel
备忘录ry - DRAM Functional Analysis
Report Code
MFR-1907-802
This report presents a Memory Floorplan Analysis of the Micron F57R die found inside the Micron MT44K32M36RCT-125 package.
This report contains the following detailed information:
This report contains the following detailed information:
- Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
- SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
- Plan-view SEM micrograph of the memory array delayered to active, WL, and BL layers
- Measurements of vertical and horizontal dimensions of major microstructural features
- Plan-view optical micrograph of the die delayered to the polysilicon layer
- Identification of major functional blocks on a polysilicon die photograph
- Table of functional block sizes and percentage die utilization
- High-resolution top metal and polysilicon die photographs delivered in CircuitVision
- Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
The Memory Analysis You Need
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